Table 4 List of PC-based hybrid structure for EMI shielding applications
From: The journey of polycarbonate-based composites towards suppressing electromagnetic radiation
Sl. No. | Filler | Matrix | Processing | SET/ RLmin/ Specific SET | Thickness | Frequency | Reference |
|---|---|---|---|---|---|---|---|
1 | CNT (5 wt%) | PC | Melt mixing, compression molding | SET ~ −24 dB | 1.85 mm | 8.2–12.4 GHz | [36] |
2 | CNT (10 wt%) | PC | Melt mixing, injection molding | SET = −27.2 dB | 12.4–18 GHz | [67] | |
3 | CNT (20 wt%) | PC | Layer of 5 films-solvent casting | SET = − 43 dB | 2.15 mm | 8.2–12.4 GHz | [72] |
4 | CNT (10 wt%) | PC | Solvent casting, compression molding (low pressure) | SET = − 35 dB (ρ = 1.1 g/cc) | 1.97 mm | 8.2–12.4 GHz | [72] |
5 | CNT (10 wt%) | PC | Solvent casting, compression molding (high pressure) | SET = − 21 dB (ρ = 1.17 g/cc) | 1.785 mm | 8.2–12.4 GHz | [72] |
6 | CNT (2 wt%) | PC (with 70 wt% PC bead) | Solution blending, compression molding | SET = -23.1 dB | 5.6 mm | 8.2–12.4 GHz | [73] |
7 | CB (10 wt%, 8 wt%) | PC | Extrusion, injection molding | SET = -18.9 dB (at 10 wt%), − 13.3 dB (at 8 wt%) | 3.2 mm | 800 MHz | [74] |
8 | CNT (8 wt%) | PC | Extrusion, injection molding | SET = -18.4 dB | 3.2 mm | 800 MHz | [74] |
9 | GNP (15 wt% GNP) | PC | Extrusion, injection molding | SET = -6.3 dB | 3.2 mm | 800 MHz | [74] |
10 | CB/CNT (5 wt% CB and 5 wt% CNT) | PC | Extrusion, injection molding | SET = -21.4 dB | 3.2 mm | 800 MHz | [74] |
11 | CB/GNP (5 wt% CB and 5 wt% GNP) | PC | Extrusion, injection molding | SET ~ -9.2 dB | 3.2 mm | 800 MHz | [74] |
12 | CNT/GNP (5 wt% CNT and 5 wt% GNP) | PC | Extrusion, injection molding | SET ~ -15.5 dB | 3.2 mm | 800 MHz | [74] |
13 | GNP/CNT (3:2 by wt) (4 wt%) | PC | Melt mixing at high T (330 °C), compression molding | SET = -21.6 dB | 5.6 mm | 8.2–12.4 GHz | [75] |
14 | GNP/CNT (3:2 by wt) (4 wt%) | PC | Melt mixing at 280 °C, compression molding | SET = -8.3 dB | 5.6 mm | 8.2–12.4 GHz | [75] |
15 | CNT (4 wt%) | PC | SET ~ -14 dB | 8.5 GHz | [76] | ||
16 | CB (6 wt%) | PC | SET ~ -13 dB | 8.5 GHz | [76] | ||
17 | GNP (12 wt%) | PC | SET ~ -7 dB | 8.5 GHz | [76] | ||
18 | CNT (3 wt%) | PC | Melt extrusion, compression molding | SET = -17 dB RL = -32.1 dB | RL @ 2 mm | SET @18 GHz RL @11.2 GHz | [77] |
19 | 3 wt% CNT/10 wt% Fe3O4 (size of Fe3O4 = 100–150 nm) | PC | Solution followed by melt extrusion, compression molding | SET ~ -19.5 dB RL = -21.8 dB | RL @ 3 mm | SET @18 GHz RL @6.1 GHz | [77] |
20 | 3 wt% CNT/10 wt% Fe3O4@C (size of Fe3O4@C = 20–80 nm; 25% as C shell and 75% as Fe3O4) | PC | Solution followed by melt extrusion, compression molding | SET = -22.8 dB RL = -41.3 dB | RL @ 1 mm | SET @18 GHz RL @17.7 GHz | [77] |
21 | CNT (3 wt%) | PC | Melt mixing (250 °C), compression molding (265 °C) | SET = -14 dB (using scalar network analyser) | 1 mm | 11 GHz | [78] |
22 | CNT (3 wt%) | PC | Solution mixing, compression molding (265 °C) | SET = -16.4 dB (using scalar network analyser) | 1 mm | 11 GHz | [78] |
23 | CNT (2 wt%) | PC | Melt mixing (250 °C), compression molding (265 °C) | SET = -19.6 dB (using scalar network analyser) | 3.5 mm | 11 GHz | [78] |
24 | a-CF (10 phr)/ a-CNT (0.5 phr) | PC | MiniMAX molder, compression molding | SET = -26 dB | 2 mm | 10 GHz | [79] |
25 | GNP (6 wt%) | PC | Solution mixing, hot compaction | SET~-47 dB | 2 mm | 8.2 GHz | [35] |
26 | 3 wt% CNT | PC | Melt mixing, compression molding | SET = -23 dB | 5 mm | 18 GHz | [80] |
27 | 3 wt% CNT/ 5 wt% rGO-Fe3O4 | PC | Melt mixing, compression molding | SET = -28 dB | 5 mm | 18 GHz | [80] |
28 | 3 wt% CNT/ 5 wt% rGO-Gd2O3 | PC | Melt mixing, compression molding | SET = -33 dB | 5 mm | 18 GHz | [80] |
29 | 4 wt% CNT/5 wt% rGO-Fe3O4 compartment approach | PC | Solution approach for compartment unit, followed by hot press | SET = -43.5 dB | 2 mm | 8.2–12.4 GHz | [81] |
30 | 4 wt% CNT/5 wt% rGO-Fe3O4 random dispersion | PC | Solution approach, followed by hot press | SET = -35.5 dB | 2 mm | 8.2–12.4 GHz | [81] |
31 | 4 wt% CNT compartment approach | PC | Solution approach for compartment unit, followed by hot press | SET = -33.2 dB | 2 mm | 8.2–12.4 GHz | [81] |
32 | 4 wt% CNT random dispersion | PC | Solution approach, followed by hot press | SET = -31 dB | 2 mm | 8.2–12.4 GHz | [81] |
33 | 7 wt% GFs and 3 wt% MFs | PC/ABS | Injection molding | SET ~ -40 dB | 2 mm | 1 Hz | [83] |
34 | PPIC (30 wt%) | PC | Solution blending | SET = -52 dB | 2 mm | 8 GHz | [84] |
35 | CNT (5 wt%) | PC | Melt mixing, compression molding | SET ~ -40 dB (theoretical- from eq. 11) | 4 mm | 500–3000 MHz | [69] |
36 | NH2 modified CNT (1 wt%) | PC/SAN | Melt blending, compression molding | SET = -14 dB | ~ 5 mm | 8–18 GHz | [57] |
37 | CNT (3 wt%) | PC | Melt mixing, compression molding | SET = -23 dB | ~ 5 mm | 18 GHz | [85] |
38 | CNT-grafted Fe3O4 (3 wt%) | PC | Melt mixing, compression molding | SET = -28 dB | ~ 5 mm | 18 GHz | [85] |
39 | CNT (3 wt%) | PC/SAN (60/40) | Melt mixing, compression molding | SET = -31 dB | ~ 5 mm | 18 GHz | [85] |
40 | CNT (3 wt%) and dopamine anchored-Fe3O4 (3 vol%) | PC/SAN (60/40) | Solution followed by melt mixing, compression molding | SET = -31 dB | ~ 5 mm | 18 GHz | [85] |
41 | CNT-grafted Fe3O4 (3 wt%) | PC/SAN (60/40) | Solution followed by melt mixing, compression molding | SET = -32.5 dB | ~ 5 mm | 18 GHz | [85] |
42 | CNT (3 wt%) | PC/SAN (50/50) | Melt mixing, compression molding | SET ~ -26 dB | ~ 5 mm | 18 GHz | [85] |
43 | CNT-grafted Fe3O4 (3 wt%) | PC/SAN (50/50) | Solution followed by melt mixing, compression molding | SET = -30 dB | ~ 5 mm | 18 GHz | [85] |
44 | CNT (3 phr CNT) | PC/ABS/SAN-g-MAH (5 phr) | Melt mixing, injection molding | SET = -5.4 to −8.4 dB | 2 mm | 0.1–1.5 GHz | [86] |
45 | Carbon fibers (15 wt%) and graphite flakes (40 wt%) | Ni-PC/ABS (45 wt%) | Melt mixing | SET = − 57 dB (@ 2000 MHz), SET = − 79 dB (@ 4000 MHz) | 500–4000 MHz | [87] | |
46 | CNT (3 wt%), Co-rGO (9.6 wt% Co, 2.4 wt% GO) | PC/SAN | Solution mixing, melt mixing | SET = -34 dB | ~ 5 mm | 18 GHz | [88] |
47 | LA-g-CNT (5 phr) | PC/PLA | Melt extrusion | EMI SE = 1.3 × 101 dB (theoretical- from eq. 10) | 0.2 mm | [82] | |
48 | PANI-CNT-Fe3O4 (3 wt%) + BT | PC/PVDF (40/60 w/w) | Melt mixing, compression molding | SET = -37 dB RL = -71 dB | 5 mm | SET @18 GHz RL @12.9 GHz | [89] |
49 | PANI-CNT-Fe3O4 (3 wt%) | PC/PVDF (40/60 w/w) | Melt mixing, compression molding | SET = -32 dB | 5 mm | 18 GHz | [89] |
50 | PANI-CNT (3 wt%) | PC/PVDF (40/60 w/w) | Melt mixing, compression molding | SET = -26 dB | 5 mm | 18 GHz | [89] |
51 | CNT (3 wt%) | PC/PVDF (40/60 w/w) | Melt mixing, compression molding | SET = -22 dB | 5 mm | 18 GHz | [89] |
52 | 3 wt% PDI-MWNT (in PVDF) + NF-NH2 (in PC) | PC/PVDF (50/50 w/w) | Melt mixing, compression molding | SET = -40 dB RL = -67 dB | 5 mm | SET @18 GHz RL @17 GHz | [90] |
53 | 3 wt% PDI-MWNT (in PVDF) + BT-NH2 (in PC) | PC/PVDF (50/50 w/w) | Melt mixing, compression molding | SET = -35 dB | 5 mm | 18 GHz | [90] |
54 | 2 wt% CNT | PC/PVDF (40/60 w/w) | Melt mixing, compression molding | SET = -18 dB | 5 mm | 18 GHz | [91] |
55 | 2 wt% IL-MWNT | PC/PVDF (40/60 w/w) | Melt mixing, compression molding | SET = -24 dB | 5 mm | 18 GHz | [91] |
56 | 5 wt% BaFe localized in PC | PC/PVDF (40/60 w/w) | Melt mixing, compression molding | SET = -7 dB | 5 mm | 18 GHz | [91] |
57 | 2 wt% IL-MWNT+ 5 wt% BaFe (all in PVDF) | PC/PVDF (40/60 w/w) | Melt mixing, compression molding | SET = -26 dB | 5 mm | 18 GHz | [91] |
58 | 2 wt% IL-MWNT (in PVDF) + 5 wt% BaFe (in PC) | PC/PVDF (40/60 w/w) | Melt mixing, compression molding | SET = -34 dB | 5 mm | 18 GHz | [91] |
59 | 2 wt% IL-MWNT (in PVDF) + 5 wt% BaFe (in PC) | PC/PVDF (40/60 w/w) with 10 wt% PMMA | Melt mixing, compression molding | SET = -37 dB | 5 mm | 18 GHz | [91] |
60 | 3 wt% CNT+ 10 wt% rGO–Ni | PC/SAN (60/40 w/w) | Solution followed by melt mixing, compression molding | SET = -48 dB | 5 mm | 18 GHz | [92] |
61 | 3 wt% CNT+ 10 wt% Ni | PC/SAN (60/40 w/w) | Solution followed by melt mixing, compression molding | SET = -32.2 dB | 5 mm | 18 GHz | [92] |
62 | 3 wt% CNT+ 5 wt% rGO | PC/SAN (60/40 w/w) | Solution followed by melt mixing, compression molding | SET = -30.8 dB | 5 mm | 18 GHz | [92] |
63 | 3 wt% CNT | PC/SAN (60/40 w/w) | Melt mixing, compression molding | SET = -25.1 dB | 5 mm | 18 GHz | [92] |
64 | 10 wt% rGO–Ni | PC/SAN (60/40 w/w) | Solution followed by melt mixing, compression molding | SET = -3 dB | 5 mm | 18 GHz | [92] |
65 | 3 wt% CNT | PC | Melt mixing, compression molding | SET = -17.3 dB | 5 mm | 18 GHz | [92] |
66 | NCCF (20 wt%)/ TiO2 (5 wt%) | PP/PC (70/30) with 5 wt% PP-g-MA | Pultrusion, screw extrusion and injection molding | SET = -51.6 dB (theoretical- from eq. 10) | Far-field | [93] | |
67 | 10 phr CNT | PC/EMA (95/5 w/w) | Melt blending | SET ~ -26 dB | 3 mm | 8.2–12.4 GHz | [94] |
68 | 15 phr IrGO | PC/EMA (95/5 w/w) | Melt blending | SET ~ -30 dB | 3 mm | 8.2–12.4 GHz | [95] |
69 | 10 wt% CNT | PC/PP (60/40 w/w) | Melt mixing, compression molding | SET = -22 dB | 2 mm | 3 GHz | [96] |
70 | 10 wt% CNT | PC/PP (60/40 w/w) with 10 wt% PP-g-MA | Melt mixing, compression molding | SET = -54.78 dB | 2 mm | 3 GHz | [96] |
71 | 10 phr graphene/ CNT hybrid (1:3) | PC/EMA (95/5 w/w) | Melt blending | SET ~ -34 dB | 8.2–12.4 GHz | [97] | |
72 | 10 phr graphene | PC/EMA (95/5 w/w) | Melt blending | SET ~ -23 dB | 8.2–12.4 GHz | [97] | |
73 | 10 phr CNTs | PC/EMA (95/5 w/w) | Melt blending | SET ~ -25 dB | 8.2–12.4 GHz | [97] | |
74 | 20 phr long CF | PC/ABS (70/30) | Pultrusion, injection molding | SET = -37.6 dB | 2 mm | 10 GHz | [98] |
75 | 20 phr chopped CF | PC/ABS (70/30) | Screw extrusion, injection molding | SET = -6.8 dB | 2 mm | 10 GHz | [98] |
76 | 20 phr long CF | PC | Pultrusion, injection molding | SET = -37.1 dB | 2 mm | 10 GHz | [98] |
77 | 20 phr chopped CF | PC | Screw extrusion, injection molding | SET = -2.8 dB | 2 mm | 10 GHz | [98] |
78 | CB (PC:ABS:CB = 0.83:0:0.17). | PC | Injection molding | SET = -9 dB | 4 mm | 800 MHz | [99] |
79 | CB (PC:ABS:CB = 0.78:0.05:0.17). | PC/ABS | Injection molding | SET = -5 dB | 4 mm | 900 MHz | [99] |
80 | CNT based- waterborne ink | PC | Multilayer with conductivity gradient | SET ~ -20 dB and above | 17.97 mm | 8–70 GHz | [100] |
81 | 2 ply- FeCoNi-coated glass fabrics (MGF), with or without Ni grid | PC | Multilayer | SET ~ -90 dB | ~ 500 μm or more | 10 ~ 11 GHz | [101] |
82 | 90% CF in CEF-NF | PC layers | Sandwiched film | SET = -38.6 dB | 0.29 mm | 30–1500 MHz | [70] |
83 | CF/Ni (Ni thickness of 1.075 mm) | PC layers | Sandwiched film | SET = -72.7 dB | 0.31 mm | 30–1500 MHz | [33] |
84 | Ni nanowire | PC layers | Multilayer with conductivity and permeability gradient | SEA = − 34.3 dB Mean SEA = − 18 dB | 600 μm | 67 GHz (@SEA) 8–67 GHz (@ mean SEA) | [63] |
85 | ITO/Au/ITO | PC | Multilayer sputter-deposited film | SET = -26.8 dB | 141 nm | 8.2–12 GHz | [102] |
86 | CF (60 wt%) | PC | PC liquid infiltration through CF- laminate formation by thermo compression | SET = − 40 dB | 2 mm | 12–18 GHz | [103] |
87 | GNP (0.5 wt%) | PC | Foam/ supercritical CO2 | specific SET = − 78 dBcm3/g | 8.5 GHz | [104] | |
88 | CNT (5 wt%) | PC | Foam/ supercritical CO2 | specific SET ~ −16 dBcm3/g | 9.5 GHz | [105] | |
89 | GNP (0.5 wt%) | PC | Foam/ supercritical CO2 | specific SET ~ − 39 dB cm3/g | 8.5 GHz | [106] | |
90 | CNT (2 wt%) | PC | Foam/ supercritical CO2 | SET ~ − 14 dB | 15–17 GHz | [107] |